CUSTOM® TechLevel™ WSF Fiber Reinforced Self-Leveling Underlayment is engineered for wood subfloors such as plywood and OSB. Its fiber-reinforced formula removes the need for reinforcing lath, providing a smooth, level surface ready for most floor coverings. With Controlled Cure Technology™, it reduces common installation issues and supports durable, long-lasting floor systems.
Key Features
- No Lath Required: Eliminates reinforcing lath on plywood and OSB to save time and labor.
- High Strength Formula: Suitable for pours from 1/4" to 1.5" for stable, durable installations.
- Low Prep Requirements: Designed for approved substrates with minimal surface preparation.
- Radiant Heat Compatible: Performs reliably with most radiant heating systems.
- Industry Compliant: Meets or exceeds TCNA and ASTM standards for floor preparation.
- Smooth Flowing Material: High flow and retention for consistent, even surfaces.
- Fire Rated: Zero flame spread per ASTM E84.
Specifications
| Property | Test Method | Typical Results |
|---|---|---|
| Pot Life (in bucket) | N/A | >15 minutes |
| Healing Time (Re-heal) | ASTM C-1708 | 10–15 minutes |
| Compressive Strength (28 days) | ASTM C-1708 | >3,500 psi |
| Flexural Strength (28 days) | ASTM C-348 | >1,350 psi (9.3 MPa) |
| Walkable Hardness | N/A | 2–4 hours |
| Installed Density (Dry) | N/A | 111.4–118.3 lb/ft³ |
| Robinson Test Rating | ASTM C-627 | Extra Heavy Use |
| Install Flooring (Ceramic / non-sensitive) | N/A | >4 hours |
| Install Flooring (Moisture-sensitive) | N/A | 16–24 hours |
CUSTOM® TechLevel™ WSF provides a stable, high-strength base for floor installations on wood subfloors. Its fiber-reinforced formula, smooth flow, and reliable curing performance make it a practical choice for professional leveling work.
